Integrated Composite Laboratory (ICL)
Department of Chemical & Biomolecular Engineering
University of Tennessee
Knoxville,Tennessee 37996 USA
Effect of the incorporation of MWCNTs and elevated annealing temperature on the morphology, microstructure, conductivity and microwave absorption properties of phthalocyanine polymer
Ø Preparation and the evolution of
morphology, microstructure and dielectric properties of graphene-based copper
Ø Facile fabrication of 3D ordered layer-by-layer graphene oxide/copper phthalocyanine nanocomposites with high dielectric properties
Ø Fabrication of fluffy and ordered graphene multilayer films with improved electromagnetic interference shielding over x-band
Ø In situ self-assembly of graphene aerogel with superelasticity and application in stress sensor
Ø Visiting Scholar in Chemical & biomolecular engineering in University of Tennessee, Knoxville, TN, USA, 2017-Present
Ø Master-Doctor Continuous Study in
materials science and engineering, School of Microelectronic and Solid state
Electronic, University of Electronic Science and Technology of China, Chengdu,
Ø Bachelor of Engineering in Applied Chemistry, School of Microelectronic and Solid state Electronic, University of Electronic Science and Technology of China, Chengdu, CHINA, 2008-2012
1. Zicheng Wang, Wei Yang, Junji Wei, Fanbin Meng, Xiaobo Liu. Preparation and microwave absorption properties of rod-like iron phthalocyanine with nitrile and nitro groups. Materials Letters, 2014, 123: 6.
2. Zicheng Wang, Renbo Wei, Xiaobo Liu. Facile fabrication of multilayer films of graphene oxide/copper phthalocyanine with high dielectric properties. RSC Advances, 2015, 5: 88306.
3. Zicheng Wang, Renbo Wei, Xiaobo Liu. Preparation and dielectric properties of copper phthalocyanine/graphene oxide nanohybrids via in situ polymerization. Journal of Materials Science, 2016, 51:4682.
4. Zicheng Wang, Renbo Wei, Xiaobo Liu. Dielectric properties of copper phthalocyanine nanocomposites incorporated with graphene oxide. Journal of Materials Science: Materials in Electronic, 2017, 28: 7437.